Electrical Engineering and Information Technology

Artistic visualization of a stacked chip resembling a skyscraper.  © TU Dresden / cfaed

Professor Max Lemme is the co-spokesperson for the new DFG Collaborative Research Centre, ‘Active-3D’. The project aims to enhance the performance of microchips by utilising the previously unused space above the chip surface.

The Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) is establishing a new Collaborative Research Centres/Transregios (CRC/TRR-404), namly Next Generation Electronics with Active Devices in Three Dimensions (Active-3D). This pioneering research project aims to take the miniaturisation of microelectronics to the next phase. With Professor Max Lemme, holder of the Chair of Electronic Devices at RWTH Aachen University, a renowned scientist from the Faculty of Electrical Engineering and Information Technology is involved in a central role as co-spokesperson. Together with Professor Thomas Mikolajick from TU Dresden, he is coordinating the joint project, in which several universities and non-university research institutions are involved.

The aim of the Collaborative Research Centre is to make the third dimension electronically usable. While conventional chips have mainly been optimised in terms of surface area, the volume above this – i.e. the area of the so-called metallisation level (back-end of line, BEOL) – is now also to be developed for active components that enable logic and memory functions as well as switchable connections. Based on new materials, innovative components are being developed and integrated into circuits and systems that offer enhanced performance, processing speed and surface area. As part of the technology-design-system co-development approach, materials, technology and circuits are being developed simultaneously. This makes it possible to distribute functionalities across the volume previously reserved for passive wiring, thus utilising the entire volume of the chip. The result could be completely new 3D electronic systems that are not only more powerful, but also more energy-efficient and compact.

‘The TRR Next Generation Electronics With Active Devices in Three Dimensions (Active-3D) will strengthen Germany’s and Europe’s position in basic microelectronics research,’ explains Professor Mikolajick. ‘The researchers involved at the various locations are ideally placed to investigate the use of the entire volume of a chip for active components.’

This major project has already resulted in the formation of a powerful network at the forefront of international electronics research. Partners include Forschungszentrum Jülich, AMO GmbH, NaMLab gGmbH, the Max Planck Institute of Microstructure Physics in Halle, and Ruhr University Bochum. The Collaborative Research Centre/Transregio format enables close, cross-location cooperation. RWTH Aachen University and TU Dresden share scientific responsibility, each contributing complementary focal points. In addition, young scientists from other universities and non-university research institutions are involved. Around 15 doctoral and postdoctoral positions have already been filled, with one further position yet to be advertised. Further vacancies will follow during the course of the project.

Vacancies will be posted on the homepage of the Max Planck Institute of Microstructure Physics.